Electrodeposition of Gold to Conformally Fill High Aspect Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols

Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of x-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in sub-micron-width silicon trenches with an aspect ratio greater than 35 over a grati...

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Detalles Bibliográficos
Autores principales: Znati, Sami A., Chedid, Nicholas, Miao, Houxun, Chen, Lei, Bennett, Eric E., Wen, Han
Formato: Online Artículo Texto
Lenguaje:English
Publicado: 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4812826/
https://www.ncbi.nlm.nih.gov/pubmed/27042384
http://dx.doi.org/10.4236/jsemat.2015.54022

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4812826/
https://www.ncbi.nlm.nih.gov/pubmed/27042384
http://dx.doi.org/10.4236/jsemat.2015.54022

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