Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism

The study of electromigration (EM) in metallisations for flexible thin film systems has not been a major concern due to low applied current densities in today's flexible electronic devices. However, the trend towards smaller and more powerful devices demands increasing current densities for fut...

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Detalles Bibliográficos
Autores principales: Putz, Barbara, Glushko, Oleksandr, Cordill, Megan J.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Taylor & Francis 2016
Materias:
Report
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4854219/
https://www.ncbi.nlm.nih.gov/pubmed/27158564
http://dx.doi.org/10.1080/21663831.2015.1105876
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author Putz, Barbara
Glushko, Oleksandr
Cordill, Megan J.
author_facet Putz, Barbara
Glushko, Oleksandr
Cordill, Megan J.
author_sort Putz, Barbara
collection PubMed
description The study of electromigration (EM) in metallisations for flexible thin film systems has not been a major concern due to low applied current densities in today's flexible electronic devices. However, the trend towards smaller and more powerful devices demands increasing current densities for future applications, making EM a reliability matter. This work investigates EM in 50 nm Au thin films with a 10 nm Cr adhesion layer on a flexible polyimide substrate at high current densities. Results indicate that EM does occur and could be used as a self-healing mechanism for flexible electronics.
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spelling pubmed-48542192016-05-04 Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism Putz, Barbara Glushko, Oleksandr Cordill, Megan J. Mater Res Lett Report The study of electromigration (EM) in metallisations for flexible thin film systems has not been a major concern due to low applied current densities in today's flexible electronic devices. However, the trend towards smaller and more powerful devices demands increasing current densities for future applications, making EM a reliability matter. This work investigates EM in 50 nm Au thin films with a 10 nm Cr adhesion layer on a flexible polyimide substrate at high current densities. Results indicate that EM does occur and could be used as a self-healing mechanism for flexible electronics. Taylor & Francis 2016-01-02 2015-10-27 /pmc/articles/PMC4854219/ /pubmed/27158564 http://dx.doi.org/10.1080/21663831.2015.1105876 Text en © 2015 The Author(s). Published by Taylor & Francis. http://creativecommons.org/licenses/by/4.0/ This is an open-access article distributed under the terms of the Creative Commons Attribution License http://creativecommons.org/licenses/by/4.0/, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
spellingShingle Report
Putz, Barbara
Glushko, Oleksandr
Cordill, Megan J.
Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism
title Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism
title_full Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism
title_fullStr Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism
title_full_unstemmed Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism
title_short Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism
title_sort electromigration in gold films on flexible polyimide substrates as a self-healing mechanism
topic Report
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4854219/
https://www.ncbi.nlm.nih.gov/pubmed/27158564
http://dx.doi.org/10.1080/21663831.2015.1105876
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AT cordillmeganj electromigrationingoldfilmsonflexiblepolyimidesubstratesasaselfhealingmechanism

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