A novel approach of chemical mechanical polishing for cadmium zinc telluride wafers

A novel approach of chemical mechanical polishing (CMP) is developed for cadmium zinc telluride (CdZnTe or CZT) wafers. The approach uses environment-friendly slurry that consists of mainly silica, hydrogen peroxide, and citric acid. This is different from the previously reported slurries that are u...

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Detalles Bibliográficos
Autores principales: Zhang, Zhenyu, Wang, Bo, Zhou, Ping, Kang, Renke, Zhang, Bi, Guo, Dongming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4880934/
https://www.ncbi.nlm.nih.gov/pubmed/27225310
http://dx.doi.org/10.1038/srep26891

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4880934/
https://www.ncbi.nlm.nih.gov/pubmed/27225310
http://dx.doi.org/10.1038/srep26891

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