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Defect engineering of the electronic transport through cuprous oxide interlayers
The electronic transport through Au–(Cu(2)O)(n)–Au junctions is investigated using first-principles calculations and the nonequilibrium Green’s function method. The effect of varying the thickness (i.e., n) is studied as well as that of point defects and anion substitution. For all Cu(2)O thicknesse...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group
2016
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4891735/ https://www.ncbi.nlm.nih.gov/pubmed/27256905 http://dx.doi.org/10.1038/srep27049 |
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author | Fadlallah, Mohamed M. Eckern, Ulrich Schwingenschlögl, Udo |
author_facet | Fadlallah, Mohamed M. Eckern, Ulrich Schwingenschlögl, Udo |
author_sort | Fadlallah, Mohamed M. |
collection | PubMed |
description | The electronic transport through Au–(Cu(2)O)(n)–Au junctions is investigated using first-principles calculations and the nonequilibrium Green’s function method. The effect of varying the thickness (i.e., n) is studied as well as that of point defects and anion substitution. For all Cu(2)O thicknesses the conductance is more enhanced by bulk-like (in contrast to near-interface) defects, with the exception of O vacancies and Cl substitutional defects. A similar transmission behavior results from Cu deficiency and N substitution, as well as from Cl substitution and N interstitials for thick Cu(2)O junctions. In agreement with recent experimental observations, it is found that N and Cl doping enhances the conductance. A Frenkel defect, i.e., a superposition of an O interstitial and O substitutional defect, leads to a remarkably high conductance. From the analysis of the defect formation energies, Cu vacancies are found to be particularly stable, in agreement with earlier experimental and theoretical work. |
format | Online Article Text |
id | pubmed-4891735 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2016 |
publisher | Nature Publishing Group |
record_format | MEDLINE/PubMed |
spelling | pubmed-48917352016-06-10 Defect engineering of the electronic transport through cuprous oxide interlayers Fadlallah, Mohamed M. Eckern, Ulrich Schwingenschlögl, Udo Sci Rep Article The electronic transport through Au–(Cu(2)O)(n)–Au junctions is investigated using first-principles calculations and the nonequilibrium Green’s function method. The effect of varying the thickness (i.e., n) is studied as well as that of point defects and anion substitution. For all Cu(2)O thicknesses the conductance is more enhanced by bulk-like (in contrast to near-interface) defects, with the exception of O vacancies and Cl substitutional defects. A similar transmission behavior results from Cu deficiency and N substitution, as well as from Cl substitution and N interstitials for thick Cu(2)O junctions. In agreement with recent experimental observations, it is found that N and Cl doping enhances the conductance. A Frenkel defect, i.e., a superposition of an O interstitial and O substitutional defect, leads to a remarkably high conductance. From the analysis of the defect formation energies, Cu vacancies are found to be particularly stable, in agreement with earlier experimental and theoretical work. Nature Publishing Group 2016-06-03 /pmc/articles/PMC4891735/ /pubmed/27256905 http://dx.doi.org/10.1038/srep27049 Text en Copyright © 2016, Macmillan Publishers Limited http://creativecommons.org/licenses/by/4.0/ This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/ |
spellingShingle | Article Fadlallah, Mohamed M. Eckern, Ulrich Schwingenschlögl, Udo Defect engineering of the electronic transport through cuprous oxide interlayers |
title | Defect engineering of the electronic transport through cuprous oxide interlayers |
title_full | Defect engineering of the electronic transport through cuprous oxide interlayers |
title_fullStr | Defect engineering of the electronic transport through cuprous oxide interlayers |
title_full_unstemmed | Defect engineering of the electronic transport through cuprous oxide interlayers |
title_short | Defect engineering of the electronic transport through cuprous oxide interlayers |
title_sort | defect engineering of the electronic transport through cuprous oxide interlayers |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4891735/ https://www.ncbi.nlm.nih.gov/pubmed/27256905 http://dx.doi.org/10.1038/srep27049 |
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