A High-Temperature Piezoresistive Pressure Sensor with an Integrated Signal-Conditioning Circuit

This paper focuses on the design and fabrication of a high-temperature piezoresistive pressure sensor with an integrated signal-conditioning circuit, which consists of an encapsulated pressure-sensitive chip, a temperature compensation circuit and a signal-conditioning circuit. A silicon on insulati...

Descripción completa

Detalles Bibliográficos
Autores principales: Yao, Zong, Liang, Ting, Jia, Pinggang, Hong, Yingping, Qi, Lei, Lei, Cheng, Zhang, Bin, Xiong, Jijun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4934339/
https://www.ncbi.nlm.nih.gov/pubmed/27322288
http://dx.doi.org/10.3390/s16060913

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4934339/
https://www.ncbi.nlm.nih.gov/pubmed/27322288
http://dx.doi.org/10.3390/s16060913

Ejemplares similares