Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method

This paper studies the three dimensional (3D) simulation of fluid flows through the ball grid array (BGA) to replicate the real underfill encapsulation process. The effect of different solder bump arrangements of BGA on the flow front, pressure and velocity of the fluid is investigated. The flow fro...

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Detalles Bibliográficos
Autores principales: Abas, Aizat, Gan, Z. L., Ishak, M. H. H., Abdullah, M. Z., Khor, Soon Fuat
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Public Library of Science 2016
Materias:
Research Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4959703/
https://www.ncbi.nlm.nih.gov/pubmed/27454872
http://dx.doi.org/10.1371/journal.pone.0159357

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4959703/
https://www.ncbi.nlm.nih.gov/pubmed/27454872
http://dx.doi.org/10.1371/journal.pone.0159357

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