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Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method
This paper studies the three dimensional (3D) simulation of fluid flows through the ball grid array (BGA) to replicate the real underfill encapsulation process. The effect of different solder bump arrangements of BGA on the flow front, pressure and velocity of the fluid is investigated. The flow fro...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Public Library of Science
2016
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4959703/ https://www.ncbi.nlm.nih.gov/pubmed/27454872 http://dx.doi.org/10.1371/journal.pone.0159357 |