Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry

We compare ultrasonic welding (UW) and thermal bonding (TB) for the integration of embedded thin-film gold electrodes for electrochemical applications in injection molded (IM) microfluidic chips. The UW bonded chips showed a significantly superior electrochemical performance compared to the ones obt...

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Detalles Bibliográficos
Autores principales: Matteucci, Marco, Heiskanen, Arto, Zór, Kinga, Emnéus, Jenny, Taboryski, Rafael
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5134454/
https://www.ncbi.nlm.nih.gov/pubmed/27801809
http://dx.doi.org/10.3390/s16111795

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5134454/
https://www.ncbi.nlm.nih.gov/pubmed/27801809
http://dx.doi.org/10.3390/s16111795

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