In situ imaging of microstructure formation in electronic interconnections

The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by synchrotron radiography. Using Sn-3.0Ag-0.5Cu/Cu and Sn-0.7Cu/Cu as examples, we show that the interfacial Cu(6)Sn(5) layer is present within...

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Detalles Bibliográficos
Autores principales: Salleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D., Nogita, K.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5227712/
https://www.ncbi.nlm.nih.gov/pubmed/28079120
http://dx.doi.org/10.1038/srep40010

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5227712/
https://www.ncbi.nlm.nih.gov/pubmed/28079120
http://dx.doi.org/10.1038/srep40010

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