In situ imaging of microstructure formation in electronic interconnections

The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by synchrotron radiography. Using Sn-3.0Ag-0.5Cu/Cu and Sn-0.7Cu/Cu as examples, we show that the interfacial Cu(6)Sn(5) layer is present within...

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Autores principales: Salleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D., Nogita, K.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5227712/
https://www.ncbi.nlm.nih.gov/pubmed/28079120
http://dx.doi.org/10.1038/srep40010
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author Salleh, M. A. A. Mohd
Gourlay, C. M.
Xian, J. W.
Belyakov, S. A.
Yasuda, H.
McDonald, S. D.
Nogita, K.
author_facet Salleh, M. A. A. Mohd
Gourlay, C. M.
Xian, J. W.
Belyakov, S. A.
Yasuda, H.
McDonald, S. D.
Nogita, K.
author_sort Salleh, M. A. A. Mohd
collection PubMed
description The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by synchrotron radiography. Using Sn-3.0Ag-0.5Cu/Cu and Sn-0.7Cu/Cu as examples, we show that the interfacial Cu(6)Sn(5) layer is present within 0.05 s of wetting, and explore the kinetics of flux void formation at the interface between the liquid and the Cu(6)Sn(5) layer. Quantification of the nucleation locations and anisotropic growth kinetics of primary Cu(6)Sn(5) crystals reveals a competition between the nucleation of Cu(6)Sn(5) in the liquid versus growth of Cu(6)Sn(5) from the existing Cu(6)Sn(5) layer. Direct imaging confirms that the β-Sn nucleates at/near the Cu(6)Sn(5) layer in Sn-3.0Ag-0.5Cu/Cu joints.
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spelling pubmed-52277122017-01-17 In situ imaging of microstructure formation in electronic interconnections Salleh, M. A. A. Mohd Gourlay, C. M. Xian, J. W. Belyakov, S. A. Yasuda, H. McDonald, S. D. Nogita, K. Sci Rep Article The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by synchrotron radiography. Using Sn-3.0Ag-0.5Cu/Cu and Sn-0.7Cu/Cu as examples, we show that the interfacial Cu(6)Sn(5) layer is present within 0.05 s of wetting, and explore the kinetics of flux void formation at the interface between the liquid and the Cu(6)Sn(5) layer. Quantification of the nucleation locations and anisotropic growth kinetics of primary Cu(6)Sn(5) crystals reveals a competition between the nucleation of Cu(6)Sn(5) in the liquid versus growth of Cu(6)Sn(5) from the existing Cu(6)Sn(5) layer. Direct imaging confirms that the β-Sn nucleates at/near the Cu(6)Sn(5) layer in Sn-3.0Ag-0.5Cu/Cu joints. Nature Publishing Group 2017-01-12 /pmc/articles/PMC5227712/ /pubmed/28079120 http://dx.doi.org/10.1038/srep40010 Text en Copyright © 2017, The Author(s) http://creativecommons.org/licenses/by/4.0/ This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/
spellingShingle Article
Salleh, M. A. A. Mohd
Gourlay, C. M.
Xian, J. W.
Belyakov, S. A.
Yasuda, H.
McDonald, S. D.
Nogita, K.
In situ imaging of microstructure formation in electronic interconnections
title In situ imaging of microstructure formation in electronic interconnections
title_full In situ imaging of microstructure formation in electronic interconnections
title_fullStr In situ imaging of microstructure formation in electronic interconnections
title_full_unstemmed In situ imaging of microstructure formation in electronic interconnections
title_short In situ imaging of microstructure formation in electronic interconnections
title_sort in situ imaging of microstructure formation in electronic interconnections
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5227712/
https://www.ncbi.nlm.nih.gov/pubmed/28079120
http://dx.doi.org/10.1038/srep40010
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