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Selective Plasma Etching of Polymeric Substrates for Advanced Applications

In today’s nanoworld, there is a strong need to manipulate and process materials on an atom-by-atom scale with new tools such as reactive plasma, which in some states enables high selectivity of interaction between plasma species and materials. These interactions first involve preferential interacti...

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Detalles Bibliográficos
Autores principales: Puliyalil, Harinarayanan, Cvelbar, Uroš
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5302619/
https://www.ncbi.nlm.nih.gov/pubmed/28335238
http://dx.doi.org/10.3390/nano6060108
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author Puliyalil, Harinarayanan
Cvelbar, Uroš
author_facet Puliyalil, Harinarayanan
Cvelbar, Uroš
author_sort Puliyalil, Harinarayanan
collection PubMed
description In today’s nanoworld, there is a strong need to manipulate and process materials on an atom-by-atom scale with new tools such as reactive plasma, which in some states enables high selectivity of interaction between plasma species and materials. These interactions first involve preferential interactions with precise bonds in materials and later cause etching. This typically occurs based on material stability, which leads to preferential etching of one material over other. This process is especially interesting for polymeric substrates with increasing complexity and a “zoo” of bonds, which are used in numerous applications. In this comprehensive summary, we encompass the complete selective etching of polymers and polymer matrix micro-/nanocomposites with plasma and unravel the mechanisms behind the scenes, which ultimately leads to the enhancement of surface properties and device performance.
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spelling pubmed-53026192017-03-21 Selective Plasma Etching of Polymeric Substrates for Advanced Applications Puliyalil, Harinarayanan Cvelbar, Uroš Nanomaterials (Basel) Review In today’s nanoworld, there is a strong need to manipulate and process materials on an atom-by-atom scale with new tools such as reactive plasma, which in some states enables high selectivity of interaction between plasma species and materials. These interactions first involve preferential interactions with precise bonds in materials and later cause etching. This typically occurs based on material stability, which leads to preferential etching of one material over other. This process is especially interesting for polymeric substrates with increasing complexity and a “zoo” of bonds, which are used in numerous applications. In this comprehensive summary, we encompass the complete selective etching of polymers and polymer matrix micro-/nanocomposites with plasma and unravel the mechanisms behind the scenes, which ultimately leads to the enhancement of surface properties and device performance. MDPI 2016-06-07 /pmc/articles/PMC5302619/ /pubmed/28335238 http://dx.doi.org/10.3390/nano6060108 Text en © 2016 by the authors; licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Review
Puliyalil, Harinarayanan
Cvelbar, Uroš
Selective Plasma Etching of Polymeric Substrates for Advanced Applications
title Selective Plasma Etching of Polymeric Substrates for Advanced Applications
title_full Selective Plasma Etching of Polymeric Substrates for Advanced Applications
title_fullStr Selective Plasma Etching of Polymeric Substrates for Advanced Applications
title_full_unstemmed Selective Plasma Etching of Polymeric Substrates for Advanced Applications
title_short Selective Plasma Etching of Polymeric Substrates for Advanced Applications
title_sort selective plasma etching of polymeric substrates for advanced applications
topic Review
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5302619/
https://www.ncbi.nlm.nih.gov/pubmed/28335238
http://dx.doi.org/10.3390/nano6060108
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