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A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications
Reliability risks for two different types of through-silicon-vias (TSVs) are discussed in this paper. The first is a partially-filled copper TSV, if which the copper layer covers the side walls and bottom. A polymer is used to fill the rest of the cavity. Stresses in risk sites are studied and ranke...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2017
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5336032/ https://www.ncbi.nlm.nih.gov/pubmed/28208758 http://dx.doi.org/10.3390/s17020322 |