The Impact of 3D Stacking and Technology Scaling on the Power and Area of Stereo Matching Processors

Recently, stereo matching processors have been adopted in real-time embedded systems such as intelligent robots and autonomous vehicles, which require minimal hardware resources and low power consumption. Meanwhile, thanks to the through-silicon via (TSV), three-dimensional (3D) stacking technology...

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Detalles Bibliográficos
Autores principales: Ok, Seung-Ho, Lee, Yong-Hwan, Shim, Jae Hoon, Lim, Sung Kyu, Moon, Byungin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5336097/
https://www.ncbi.nlm.nih.gov/pubmed/28241437
http://dx.doi.org/10.3390/s17020426

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5336097/
https://www.ncbi.nlm.nih.gov/pubmed/28241437
http://dx.doi.org/10.3390/s17020426

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