Cargando…
The Impact of 3D Stacking and Technology Scaling on the Power and Area of Stereo Matching Processors
Recently, stereo matching processors have been adopted in real-time embedded systems such as intelligent robots and autonomous vehicles, which require minimal hardware resources and low power consumption. Meanwhile, thanks to the through-silicon via (TSV), three-dimensional (3D) stacking technology...
| Autores principales: | , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2017
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5336097/ https://www.ncbi.nlm.nih.gov/pubmed/28241437 http://dx.doi.org/10.3390/s17020426 |