Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Mixtures of a copper complex and copper fine particles as copper-based metal-organic decomposition (MOD) dispersions have been demonstrated to be effective for low-temperature sintering of conductive copper film. However, the copper particle size effect on decomposition process of the dispersion dur...

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Detalles Bibliográficos
Autores principales: Yong, Yingqiong, Nguyen, Mai Thanh, Tsukamoto, Hiroki, Matsubara, Masaki, Liao, Ying-Chih, Yonezawa, Tetsu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5364527/
https://www.ncbi.nlm.nih.gov/pubmed/28338044
http://dx.doi.org/10.1038/srep45150

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5364527/
https://www.ncbi.nlm.nih.gov/pubmed/28338044
http://dx.doi.org/10.1038/srep45150

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