Multi-spectral imaging with infrared sensitive organic light emitting diode

Commercially available near-infrared (IR) imagers are fabricated by integrating expensive epitaxial grown III-V compound semiconductor sensors with Si-based readout integrated circuits (ROIC) by indium bump bonding which significantly increases the fabrication costs of these image sensors. Furthermo...

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Detalles Bibliográficos
Autores principales: Kim, Do Young, Lai, Tzung-Han, Lee, Jae Woong, Manders, Jesse R., So, Franky
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2014
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5380012/
https://www.ncbi.nlm.nih.gov/pubmed/25091589
http://dx.doi.org/10.1038/srep05946

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5380012/
https://www.ncbi.nlm.nih.gov/pubmed/25091589
http://dx.doi.org/10.1038/srep05946

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