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Multi-spectral imaging with infrared sensitive organic light emitting diode
Commercially available near-infrared (IR) imagers are fabricated by integrating expensive epitaxial grown III-V compound semiconductor sensors with Si-based readout integrated circuits (ROIC) by indium bump bonding which significantly increases the fabrication costs of these image sensors. Furthermo...
Autores principales: | Kim, Do Young, Lai, Tzung-Han, Lee, Jae Woong, Manders, Jesse R., So, Franky |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group
2014
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5380012/ https://www.ncbi.nlm.nih.gov/pubmed/25091589 http://dx.doi.org/10.1038/srep05946 |
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