Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

A reliable Cu–Cu bonding joint was achieved by using the highly sinterable Cu nanoparticle paste. Pure copper nanoparticles used in the preparation of nanoparticle paste were synthesized through simple routes, with an average size of 60.5 nm. Under an Ar-H(2) gas mixture atmosphere, the Cu nanoparti...

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Detalles Bibliográficos
Autores principales: Li, Junjie, Yu, Xing, Shi, Tielin, Cheng, Chaoliang, Fan, Jinhu, Cheng, Siyi, Liao, Guanglan, Tang, Zirong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer US 2017
Materias:
Nano Express
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5382117/
https://www.ncbi.nlm.nih.gov/pubmed/28384997
http://dx.doi.org/10.1186/s11671-017-2037-5

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5382117/
https://www.ncbi.nlm.nih.gov/pubmed/28384997
http://dx.doi.org/10.1186/s11671-017-2037-5

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