Effects of Post-Deposition Annealing on ZrO(2)/n-GaN MOS Capacitors with H(2)O and O(3) as the Oxidizers

GaN-based metal-oxide-semiconductor capacitors with ZrO(2) as the dielectric layer have been prepared by atomic layer deposition. The accumulation and depletion regions can be clearly distinguished when the voltage was swept from −4 to 4 V. Post-annealing results suggested that the capacitance in accumulation region went up gradually as the annealing temperature increased from 300 to 500 °C. A minimum leakage current density of 3 × 10(−9) A/cm(2) at 1 V was obtained when O(3) was used for the growth of ZrO(2). Leakage analysis revealed that Schottky emission and Fowler-Nordheim tunneling were the main leakage mechanisms.