Modeling the Microstructure Curvature of Boron-Doped Silicon in Bulk Micromachined Accelerometer

Microstructure curvature, or buckling, is observed in the micromachining of silicon sensors because of the doping of impurities for realizing certain electrical and mechanical processes. This behavior can be a key source of error in inertial sensors. Therefore, identifying the factors that influence...

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Detalles Bibliográficos
Autores principales: Zhou, Wu, Yu, Huijun, Peng, Bei, Shen, Huaqin, He, Xiaoping, Su, Wei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2013
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5452111/
https://www.ncbi.nlm.nih.gov/pubmed/28809305
http://dx.doi.org/10.3390/ma6010244

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5452111/
https://www.ncbi.nlm.nih.gov/pubmed/28809305
http://dx.doi.org/10.3390/ma6010244

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