Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging

A three-dimensional integrated circuit (3D-IC) structure with a significant scale mismatch causes difficulty in analytic model construction. This paper proposes a simulation technique to introduce an equivalent material composed of microbumps and their surrounding wafer level underfill (WLUF). The m...

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Detalles Bibliográficos
Autores principales: Lee, Chang-Chun, Tzeng, Tzai-Liang, Huang, Pei-Chen
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5455527/
https://www.ncbi.nlm.nih.gov/pubmed/28793495
http://dx.doi.org/10.3390/ma8085121

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5455527/
https://www.ncbi.nlm.nih.gov/pubmed/28793495
http://dx.doi.org/10.3390/ma8085121

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