An Optimal Cure Process to Minimize Residual Void and Optical Birefringence for a LED Silicone Encapsulant

Silicone resin has recently attracted great attention as a high-power Light Emitting Diode (LED) encapsulant material due to its good thermal stability and optical properties. In general, the abrupt curing reaction of the silicone resin for the LED encapsulant during the curing process induces reduc...

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Detalles Bibliográficos
Autores principales: Song, Min-Jae, Kim, Kwon-Hee, Yoon, Gil-Sang, Park, Hyung-Pil, Kim, Heung-Kyu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2014
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5455899/
https://www.ncbi.nlm.nih.gov/pubmed/28788666
http://dx.doi.org/10.3390/ma7064088

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5455899/
https://www.ncbi.nlm.nih.gov/pubmed/28788666
http://dx.doi.org/10.3390/ma7064088

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