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An Optimal Cure Process to Minimize Residual Void and Optical Birefringence for a LED Silicone Encapsulant
Silicone resin has recently attracted great attention as a high-power Light Emitting Diode (LED) encapsulant material due to its good thermal stability and optical properties. In general, the abrupt curing reaction of the silicone resin for the LED encapsulant during the curing process induces reduc...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2014
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5455899/ https://www.ncbi.nlm.nih.gov/pubmed/28788666 http://dx.doi.org/10.3390/ma7064088 |