Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a sold...

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Detalles Bibliográficos
Autores principales: Rahman, Mohd Nizam Ab., Zubir, Noor Suhana Mohd, Leuveano, Raden Achmad Chairdino, Ghani, Jaharah A., Mahmood, Wan Mohd Faizal Wan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2014
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5456432/
https://www.ncbi.nlm.nih.gov/pubmed/28788270
http://dx.doi.org/10.3390/ma7127706

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5456432/
https://www.ncbi.nlm.nih.gov/pubmed/28788270
http://dx.doi.org/10.3390/ma7127706

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