Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects

Miniaturization of electronic devices has led to the development of 3D IC packages which require ultra-small-scale interconnections. Such small interconnects can be completely converted into Cu-Sn based intermetallic compounds (IMCs) after reflow. In an effort to improve IMC based interconnects, an...

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Detalles Bibliográficos
Autores principales: Chia, Pay Ying, Haseeb, A. S. M. A., Mannan, Samjid Hassan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5456830/
https://www.ncbi.nlm.nih.gov/pubmed/28773552
http://dx.doi.org/10.3390/ma9060430

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5456830/
https://www.ncbi.nlm.nih.gov/pubmed/28773552
http://dx.doi.org/10.3390/ma9060430

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