High-Temperature Storage Testing of ACF Attached Sensor Structures

Several electronic applications must withstand elevated temperatures during their lifetime. Materials and packages for use in high temperatures have been designed, but they are often very expensive, have limited compatibility with materials, structures, and processing techniques, and are less readil...

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Detalles Bibliográficos
Autores principales: Lahokallio, Sanna, Hoikkanen, Maija, Vuorinen, Jyrki, Frisk, Laura
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5458852/
https://www.ncbi.nlm.nih.gov/pubmed/28793735
http://dx.doi.org/10.3390/ma8125455

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5458852/
https://www.ncbi.nlm.nih.gov/pubmed/28793735
http://dx.doi.org/10.3390/ma8125455

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