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High-Temperature Storage Testing of ACF Attached Sensor Structures
Several electronic applications must withstand elevated temperatures during their lifetime. Materials and packages for use in high temperatures have been designed, but they are often very expensive, have limited compatibility with materials, structures, and processing techniques, and are less readil...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2015
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5458852/ https://www.ncbi.nlm.nih.gov/pubmed/28793735 http://dx.doi.org/10.3390/ma8125455 |