Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

This study illustrates test results and comparative literature data on the influence of isothermal aging and thermal cycling associated with Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) ball grid array (BGA) solder joints finished with ENIG and ENEPIG on the board side and ENIG on the package...

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Detalles Bibliográficos
Autores principales: Shen, Chaobo, Hai, Zhou, Zhao, Cong, Zhang, Jiawei, Evans, John L., Bozack, Michael J., Suhling, Jeffrey C.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5459027/
https://www.ncbi.nlm.nih.gov/pubmed/28772811
http://dx.doi.org/10.3390/ma10050451

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5459027/
https://www.ncbi.nlm.nih.gov/pubmed/28772811
http://dx.doi.org/10.3390/ma10050451

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