Study of a Compression-Molding Process for Ultraviolet Light-Emitting Diode Exposure Systems via Finite-Element Analysis

Although wafer-level camera lenses are a very promising technology, problems such as warpage with time and non-uniform thickness of products still exist. In this study, finite element simulation was performed to simulate the compression molding process for acquiring the pressure distribution on the...

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Detalles Bibliográficos
Autores principales: Wu, Kuo-Tsai, Hwang, Sheng-Jye, Lee, Huei-Huang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5492456/
https://www.ncbi.nlm.nih.gov/pubmed/28617315
http://dx.doi.org/10.3390/s17061392

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5492456/
https://www.ncbi.nlm.nih.gov/pubmed/28617315
http://dx.doi.org/10.3390/s17061392

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