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Study of a Compression-Molding Process for Ultraviolet Light-Emitting Diode Exposure Systems via Finite-Element Analysis
Although wafer-level camera lenses are a very promising technology, problems such as warpage with time and non-uniform thickness of products still exist. In this study, finite element simulation was performed to simulate the compression molding process for acquiring the pressure distribution on the...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2017
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5492456/ https://www.ncbi.nlm.nih.gov/pubmed/28617315 http://dx.doi.org/10.3390/s17061392 |