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Strong Photoluminescence Enhancement of Silicon Oxycarbide through Defect Engineering
The following study focuses on the photoluminescence (PL) enhancement of chemically synthesized silicon oxycarbide (SiC(x)O(y)) thin films and nanowires through defect engineering via post-deposition passivation treatments. SiC(x)O(y) materials were deposited via thermal chemical vapor deposition (T...
Autores principales: | , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2017
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5506893/ https://www.ncbi.nlm.nih.gov/pubmed/28772802 http://dx.doi.org/10.3390/ma10040446 |
Sumario: | The following study focuses on the photoluminescence (PL) enhancement of chemically synthesized silicon oxycarbide (SiC(x)O(y)) thin films and nanowires through defect engineering via post-deposition passivation treatments. SiC(x)O(y) materials were deposited via thermal chemical vapor deposition (TCVD), and exhibit strong white light emission at room-temperature. Post-deposition passivation treatments were carried out using oxygen, nitrogen, and forming gas (FG, 5% H(2), 95% N(2)) ambients, modifying the observed white light emission. The observed white luminescence was found to be inversely related to the carbonyl (C=O) bond density present in the films. The peak-to-peak PL was enhanced ~18 and ~17 times for, respectively, the two SiC(x)O(y) matrices, oxygen-rich and carbon-rich SiC(x)O(y), via post-deposition passivations. Through a combinational and systematic Fourier transform infrared spectroscopy (FTIR) and PL study, it was revealed that proper tailoring of the passivations reduces the carbonyl bond density by a factor of ~2.2, corresponding to a PL enhancement of ~50 times. Furthermore, the temperature-dependent and temperature-dependent time resolved PL (TDPL and TD-TRPL) behaviors of the nitrogen and forming gas passivated SiC(x)O(y) thin films were investigated to acquire further insight into the ramifications of the passivation on the carbonyl/dangling bond density and PL yield. |
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