Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface

Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational spee...

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Detalles Bibliográficos
Autores principales: Huang, Ching An, Yeh, Yu Hu, Lin, Che Kuan, Hsieh, Chen Yun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2014
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5512640/
https://www.ncbi.nlm.nih.gov/pubmed/28788252
http://dx.doi.org/10.3390/ma7117366

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5512640/
https://www.ncbi.nlm.nih.gov/pubmed/28788252
http://dx.doi.org/10.3390/ma7117366

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