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Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface
Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational spee...
Autores principales: | Huang, Ching An, Yeh, Yu Hu, Lin, Che Kuan, Hsieh, Chen Yun |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2014
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5512640/ https://www.ncbi.nlm.nih.gov/pubmed/28788252 http://dx.doi.org/10.3390/ma7117366 |
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