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Thermal Conductivity of Diamond Composites
A major problem challenging specialists in present-day materials sciences is the development of compact, cheap to fabricate heat sinks for electronic devices, primarily for computer processors, semiconductor lasers, high-power microchips, and electronics components. The materials currently used for...
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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Molecular Diversity Preservation International
2009
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5513588/ http://dx.doi.org/10.3390/ma2042467 |