Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications

Copper/diamond (Cu/D) composites are famous in thermal management applications for their high thermal conductivity values. They, however, offer some interface related problems like high thermal boundary resistance and excessive debonding. This paper investigates interfacial debonding in Cu/D composi...

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Detalles Bibliográficos
Autores principales: Zain-ul-abdein, Muhammad, Ijaz, Hassan, Saleem, Waqas, Raza, Kabeer, Salmeen Bin Mahfouz, Abdullah, Mabrouki, Tarek
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5551782/
https://www.ncbi.nlm.nih.gov/pubmed/28773098
http://dx.doi.org/10.3390/ma10070739

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5551782/
https://www.ncbi.nlm.nih.gov/pubmed/28773098
http://dx.doi.org/10.3390/ma10070739

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