RGO and Three-Dimensional Graphene Networks Co-modified TIMs with High Performances

With the development of microelectronic devices, the insufficient heat dissipation ability becomes one of the major bottlenecks for further miniaturization. Although graphene-assisted epoxy resin (ER) display promising potential to enhance the thermal performances, some limitations of the reduced gr...

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Detalles Bibliográficos
Autores principales: Bo, Tang, Zhengwei, Wang, Huang, Weiqiu, Sen, Li, Tingting, Ma, Haogang, Yu, Xufei, Li
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer US 2017
Materias:
Nano Express
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5585116/
https://www.ncbi.nlm.nih.gov/pubmed/28875303
http://dx.doi.org/10.1186/s11671-017-2298-z

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5585116/
https://www.ncbi.nlm.nih.gov/pubmed/28875303
http://dx.doi.org/10.1186/s11671-017-2298-z

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