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RGO and Three-Dimensional Graphene Networks Co-modified TIMs with High Performances
With the development of microelectronic devices, the insufficient heat dissipation ability becomes one of the major bottlenecks for further miniaturization. Although graphene-assisted epoxy resin (ER) display promising potential to enhance the thermal performances, some limitations of the reduced gr...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer US
2017
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5585116/ https://www.ncbi.nlm.nih.gov/pubmed/28875303 http://dx.doi.org/10.1186/s11671-017-2298-z |