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Intermetallic compounds in 3D integrated circuits technology: a brief review
The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-f...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Taylor & Francis
2017
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5642821/ https://www.ncbi.nlm.nih.gov/pubmed/29057024 http://dx.doi.org/10.1080/14686996.2017.1364975 |