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Intermetallic compounds in 3D integrated circuits technology: a brief review

The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-f...

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Detalles Bibliográficos
Autores principales:	Annuar, Syahira, Mahmoodian, Reza, Hamdi, Mohd, Tu, King-Ning
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	Taylor & Francis 2017
Materias:	Optical, Magnetic and Electronic Device Materials
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5642821/ https://www.ncbi.nlm.nih.gov/pubmed/29057024 http://dx.doi.org/10.1080/14686996.2017.1364975

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