Substrate-Influenced Thermo-Mechanical Fatigue of Copper Metallizations: Limits of Stoney’s Equation

Rapid progress in the reduction of substrate thickness for silicon-based microelectronics leads to a significant reduction of the device bending stiffness and the need to address its implication for the thermo-mechanical fatigue behavior of metallization layers. Results on 5 µm thick Cu films reveal...

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Detalles Bibliográficos
Autores principales: Bigl, Stephan, Wurster, Stefan, Cordill, Megan J., Kiener, Daniel
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Letter
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5706234/
https://www.ncbi.nlm.nih.gov/pubmed/29120407
http://dx.doi.org/10.3390/ma10111287

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5706234/
https://www.ncbi.nlm.nih.gov/pubmed/29120407
http://dx.doi.org/10.3390/ma10111287

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