3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer †

This paper reports a 3-axis fully integrated differential capacitive tactile sensor surface-mountable on a bus line. The sensor integrates a flip-bonded complementary metal-oxide semiconductor (CMOS) with capacitive sensing circuits on a low temperature cofired ceramic (LTCC) interposer with Au thro...

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Detalles Bibliográficos
Autores principales: Asano, Sho, Muroyama, Masanori, Nakayama, Takahiro, Hata, Yoshiyuki, Nonomura, Yutaka, Tanaka, Shuji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5713648/
https://www.ncbi.nlm.nih.gov/pubmed/29068429
http://dx.doi.org/10.3390/s17112451

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5713648/
https://www.ncbi.nlm.nih.gov/pubmed/29068429
http://dx.doi.org/10.3390/s17112451

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