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Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections
While many aspects of electronics manufacturing are controlled with great precision, the nucleation of tin in solder joints is currently left to chance. This leads to a widely varying melt undercooling and different crystal orientations in each joint, which results in a different resistance to elect...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2017
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5715011/ https://www.ncbi.nlm.nih.gov/pubmed/29203763 http://dx.doi.org/10.1038/s41467-017-01727-6 |