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Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS

A highly efficient and reproducible cleaning procedure of piezoelectric substrates is essential in surface acoustic waves (SAW) technology to fabricate high-quality SAW devices, especially for new applications such SAW sensors wherein new materials for piezoelectric substrates and interdigital trans...

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Autores principales: Brachmann, Erik, Seifert, Marietta, Oswald, Steffen, Menzel, Siegfried B., Gemming, Thomas
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5744308/
https://www.ncbi.nlm.nih.gov/pubmed/29189721
http://dx.doi.org/10.3390/ma10121373
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author Brachmann, Erik
Seifert, Marietta
Oswald, Steffen
Menzel, Siegfried B.
Gemming, Thomas
author_facet Brachmann, Erik
Seifert, Marietta
Oswald, Steffen
Menzel, Siegfried B.
Gemming, Thomas
author_sort Brachmann, Erik
collection PubMed
description A highly efficient and reproducible cleaning procedure of piezoelectric substrates is essential in surface acoustic waves (SAW) technology to fabricate high-quality SAW devices, especially for new applications such SAW sensors wherein new materials for piezoelectric substrates and interdigital transducers are used. Therefore, the development and critical evaluation of cleaning procedures for each material system that is under consideration becomes crucial. Contaminants like particles or the presence of organic/inorganic material on the substrate can dramatically influence and alter the properties of the thin film substrate composite, such as wettability, film adhesion, film texture, and so on. In this article, focus is given to different cleaning processes like SC-1 and SC-2, UV-ozone treatment, as well as cleaning by first-contact polymer Opticlean, which are applied for removal of contaminants from the piezoelectric substrate Ca [Formula: see text] TaGa [Formula: see text] Si [Formula: see text] O [Formula: see text]. By means of X-ray photoelectron spectroscopy, the presence of the most critical contaminants such as carbon, sodium, and iron removed through different cleaning procedures were studied and significant differences were observed between the outcomes of these procedures. Based on these results, a two-step cleaning process, combining SC-1 at a reduced temperature at 30 [Formula: see text] C instead of 80 [Formula: see text] C and a subsequent UV-ozone cleaning directly prior to deposition of the metallization, is suggested to achieve the lowest residual contamination level.
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spelling pubmed-57443082017-12-31 Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS Brachmann, Erik Seifert, Marietta Oswald, Steffen Menzel, Siegfried B. Gemming, Thomas Materials (Basel) Article A highly efficient and reproducible cleaning procedure of piezoelectric substrates is essential in surface acoustic waves (SAW) technology to fabricate high-quality SAW devices, especially for new applications such SAW sensors wherein new materials for piezoelectric substrates and interdigital transducers are used. Therefore, the development and critical evaluation of cleaning procedures for each material system that is under consideration becomes crucial. Contaminants like particles or the presence of organic/inorganic material on the substrate can dramatically influence and alter the properties of the thin film substrate composite, such as wettability, film adhesion, film texture, and so on. In this article, focus is given to different cleaning processes like SC-1 and SC-2, UV-ozone treatment, as well as cleaning by first-contact polymer Opticlean, which are applied for removal of contaminants from the piezoelectric substrate Ca [Formula: see text] TaGa [Formula: see text] Si [Formula: see text] O [Formula: see text]. By means of X-ray photoelectron spectroscopy, the presence of the most critical contaminants such as carbon, sodium, and iron removed through different cleaning procedures were studied and significant differences were observed between the outcomes of these procedures. Based on these results, a two-step cleaning process, combining SC-1 at a reduced temperature at 30 [Formula: see text] C instead of 80 [Formula: see text] C and a subsequent UV-ozone cleaning directly prior to deposition of the metallization, is suggested to achieve the lowest residual contamination level. MDPI 2017-11-30 /pmc/articles/PMC5744308/ /pubmed/29189721 http://dx.doi.org/10.3390/ma10121373 Text en © 2017 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Brachmann, Erik
Seifert, Marietta
Oswald, Steffen
Menzel, Siegfried B.
Gemming, Thomas
Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS
title Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS
title_full Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS
title_fullStr Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS
title_full_unstemmed Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS
title_short Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS
title_sort evaluation of surface cleaning procedures for ctgs substrates for saw technology with xps
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5744308/
https://www.ncbi.nlm.nih.gov/pubmed/29189721
http://dx.doi.org/10.3390/ma10121373
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