Laser Scanning Confocal Thermoreflectance Microscope for the Backside Thermal Imaging of Microelectronic Devices

In this paper, we report on a confocal thermoreflectance imaging system that can examine the thermal characteristics of microelectronic devices by penetrating the backside of a device through the substrate. In this system, the local reflectivity variations due to heat generation in the device are me...

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Detalles Bibliográficos
Autores principales: Kim, Dong Uk, Jeong, Chan Bae, Kim, Jung Dae, Lee, Kye-Sung, Hur, Hwan, Nam, Ki-Hwan, Kim, Geon Hee, Chang, Ki Soo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5751510/
https://www.ncbi.nlm.nih.gov/pubmed/29189725
http://dx.doi.org/10.3390/s17122774

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5751510/
https://www.ncbi.nlm.nih.gov/pubmed/29189725
http://dx.doi.org/10.3390/s17122774

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