Cargando…
Growth kinetics of Cu(6)Sn(5) intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current
In this paper, electric currents with the densities of 1.0 × 10(2) A/cm(2) and 2.0 × 10(2) A/cm(2) were imposed to the Cu-liquid Sn interfacial reaction at 260 °C and 300 °C with the bonding times from 15 min to 960 min. Unlike the symmetrical growth following a cubic root dependence on time during...
| Autores principales: | , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2018
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5788868/ https://www.ncbi.nlm.nih.gov/pubmed/29379073 http://dx.doi.org/10.1038/s41598-018-20100-1 |