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Growth kinetics of Cu(6)Sn(5) intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current
In this paper, electric currents with the densities of 1.0 × 10(2) A/cm(2) and 2.0 × 10(2) A/cm(2) were imposed to the Cu-liquid Sn interfacial reaction at 260 °C and 300 °C with the bonding times from 15 min to 960 min. Unlike the symmetrical growth following a cubic root dependence on time during...
Autores principales: | Feng, Jiayun, Hang, Chunjin, Tian, Yanhong, Liu, Baolei, Wang, Chenxi |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group UK
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5788868/ https://www.ncbi.nlm.nih.gov/pubmed/29379073 http://dx.doi.org/10.1038/s41598-018-20100-1 |
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