Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering...

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Detalles Bibliográficos
Autores principales: Li, Yulong, Long, Weifeng, Hu, Xiaowu, Fu, Yanshu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5793582/
https://www.ncbi.nlm.nih.gov/pubmed/29316625
http://dx.doi.org/10.3390/ma11010084

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5793582/
https://www.ncbi.nlm.nih.gov/pubmed/29316625
http://dx.doi.org/10.3390/ma11010084

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