Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing

The development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer c...

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Detalles Bibliográficos
Autores principales: Ji, Seok Young, Choi, Wonsuk, Kim, Hoon-Young, Jeon, Jin-Woo, Cho, Sung-Hak, Chang, Won Seok
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5848965/
https://www.ncbi.nlm.nih.gov/pubmed/29425144
http://dx.doi.org/10.3390/ma11020268

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5848965/
https://www.ncbi.nlm.nih.gov/pubmed/29425144
http://dx.doi.org/10.3390/ma11020268

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