Enhanced Ti(0.84)Ta(0.16)N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si(001) wafers and Cu overlayers

We compare the performance of conventional DC magnetron sputter-deposited (DCMS) TiN diffusion barriers between Cu overlayers and Si(001) substrates with Ti(0.84)Ta(0.16)N barriers grown by hybrid DCMS/high-power impulse magnetron sputtering (HiPIMS) with substrate bias synchronized to the metal-ric...

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Detalles Bibliográficos
Autores principales: Mühlbacher, Marlene, Greczynski, Grzegorz, Sartory, Bernhard, Schalk, Nina, Lu, Jun, Petrov, Ivan, Greene, J. E., Hultman, Lars, Mitterer, Christian
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5876326/
https://www.ncbi.nlm.nih.gov/pubmed/29599468
http://dx.doi.org/10.1038/s41598-018-23782-9

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5876326/
https://www.ncbi.nlm.nih.gov/pubmed/29599468
http://dx.doi.org/10.1038/s41598-018-23782-9

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