A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps

Microbumps in three-dimensional integrated circuit now becomes essential technology to reach higher packaging density. However, the small volume of microbumps dramatically changes the characteristics from the flip-chip (FC) solder joints. For a 20 µm diameter microbump, the cross-section area and th...

Descripción completa

Detalles Bibliográficos
Autores principales: Chang, Yuan-Wei, Hu, Chia-chia, Peng, Hsin-Ying, Liang, Yu-Chun, Chen, Chih, Chang, Tao-chih, Zhan, Chau-Jie, Juang, Jing-Ye
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5897565/
https://www.ncbi.nlm.nih.gov/pubmed/29651034
http://dx.doi.org/10.1038/s41598-018-23809-1

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5897565/
https://www.ncbi.nlm.nih.gov/pubmed/29651034
http://dx.doi.org/10.1038/s41598-018-23809-1

Ejemplares similares